Greater geometry control. Unmatched process support.
Wafer processing by DarmanN Semiconductor
Consistency, quality, and control: Darmann leverages decades of precision grinding expertise to custom-engineer thinning/back-grinding products that optimize your wafer processing application.
Reach micrometer-level precision with diamond abrasive tools specifically designed to meet and exceed the results of the leading suppliers while lowering your total cost of ownership.
Ra 0.02 nm surface finishes
achieved with Darmann back-grinding wheels
40 years
of precision abrasive expertise