Ultra-fine wafer cuts. Major production savings.
Dicing and dressing for semiconductor
Darmann’s full line of dicing blades and dressing boards equip your facility to make precise, consistent cuts at the consistency you need and a lower total operating cost.
Your semiconductor fabrication shouldn’t be held back by vertical constraints and supply chain risk. Darmann is ready to meet your rapid demand while ensuring micron-level precision and a greater product lifespan than the competition.
1 μm thinner wafer kerf width
than the leading competitor
Wafer dicing and package singulation
both supported by Darmann products
Our dicing blade products
Hubbed dicing blades
| Application | IC TSK 3000T | GaAs DAD3221 | SiC DFD6362 | MOS DAD3350 | Schottky DAD322 |
|---|---|---|---|---|---|
| Products | IC wafers | LED GaAs chip | SiC wafers | Wafer | Schottky chip |
| Blade type / model | Z1: 3500-R-90 CCC Z2: 3000-R-50 DCB |
5000-R-90 AAA | Z2: 2000-R-70 ECC | 3000-R-70-DCB | 4000-R-90-CBA |
| Spindle speed | Z1: 45k/rpm Z2: 32k/rpm |
38k/rpm | 30k/rpm | 30k/rpm | 35k/rpm |
| Blade size | 12 inch | 4 inch | 6 inch | 8 inch | 6 inch |
| Die size (mm) | 0.65 x 1.35 x 0.3 | 0.22 x 0.22 x 0.14 | 3.5 x 3.5 x 0.16 | 0.75 x 0.75 x 0.2 | 0.85 x 0.6 x 0.25 |
| Product material | Metal layer on front silicon on the back |
Backing gold | Silicon carbide | Back silver | Back silver |
| Feed rate | 50 mm/s | Z1: 25 mm/s Z2: 30 mm/s |
2 mm/s | 95 mm/s | 60 mm/s |
| Cutting up the street | 0.06 mm | 0.04 mm | 0.06 mm | 0.06 mm | 0.05 mm |
| Lifetime (requirement) | Z1: > 7500 m Z2: 1600 m |
≥ 2500 m | 300 m | ≥ 1800 m | 1200 m |
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Hubless dicing blades
| Blade type | Hubless EP dicing blade | Hubless EP blade case – LED | Hubless MB blade case – CSP | Hubless MB blade case – glass | Hubless MB blade case – ceramics | Hubless resin blade case – QFN |
|---|---|---|---|---|---|---|
| Model |  |
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| Applications | DAD3350 | DAD3350 | DFD6340 | DAD321 | DAD3350 | Disco 3350 |
| Blade / frame size | PCB | LED substrates | Filters (CSP) | Coated glass | LTCC filters | DFN / QFN |
| Die size | 130 x 55 x 0.5 mm | 105 x 50 x 0.75 mm | 120 x 60 mm | 60 x 40 x 0.65 mm | 120 x 60 x 0.6 mm | 256 x 68 mm |
| Die size | 1.7 x 0.9 mm | 2.0 x 2.2 mm | 0.8 x 1 x 0.6 mm | 2 x 2.5 mm | 3.5 x 3.5 mm | 3 x 3 x 0.55 mm 10 x 10 x 0.75 mm |
| Product material | PCB + Copper | Ceramics | Ceramic + Epoxy Resin | Fiberglass | Ceramics | Epoxy resin + copper frame |
| Spindle speed | 30K rpm | 25K rpm | 25K rpm | 24K rpm | 30K rpm | 24K rpm |
| Feed rate | 200 mm/s | 8 mm/s | 8 mm/s | 3 mm/s | 6 mm/s | 50 mm/s |
| Cutting up the street | 0.1 mm | 0.2 mm | 0.06 mm | 0.15 mm | 0.08 mm | 0.3 mm |
| Lifetime (requirement) | 10,000 meters | 400 meters | 400 meters | 300 meters | 400 meters | ≥ 3000 meters |
| Advantage | Average service life of 11,000 meters, comparable to currently used blades. | Average service life of 450 meters, better than current blades. | Life expectancy up to 450 meters or more, stable product quality, no chipping found. | Average life of 360 meters, quality is better than competitor's blade, cutting verticality is good. | Average life of 500 meters, better than the customer's current blade. | Average life is 10% longer than competitors, stable product quality. |
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Compatible semiconductor materials
Silicon
Silicon carbide
Gallium nitride
Gallium arsenide
Glass
Ceramic
Sapphire
Darmann Semiconductor dicing blades are plug-and-play compatible with every major dicing blade application. Thanks to proprietary engineering and a more personal approach to business, we lower total cost of ownership without sacrificing blade lifespan, wafer cut quality or production output.
Our dressing board products
Resin dressing boards
37.5 × 75 × 1 mm
75 × 75 × 1 mm
100 – 10,000 mesh
Vitrified dressing boards
75 × 75 × 2 mm
100 – 6000 grit
| Abrasive grit size | Resin bond | Vitrified bond | |
|---|---|---|---|
| GC | WA | GC | |
| 10000 | DGC60 | – | – |
| 8000 | DGC50 | – | – |
| 6000 | DGC40 | DWV40 | DGV40 |
| 4000 | DGC35 | DWV35 | DGV35 |
| 3000 | DGC30 | DWV30 | DGV30 |
| 2000 | DGC20 | DWV20 | DGV20 |
| 1200 | DGC12 | DWV12 | DGV12 |
| 1000 | DGC10 | DWV10 | DGV10 |
| 800 | DGC08 | DWV08 | DGV08 |
| 700 | DGC07 | DWV07 | DGV07 |
| 600 | DGC06 | DWV06 | DGV06 |
| 500 | DGC05 | DWV05 | DGV05 |
| 400 | DGC04 | DWV04 | DGV04 |
| 320 | DGC320 | DWV320 | DGV320 |
| 280 | DGC280 | DWV280 | DGV280 |
| 220 | DGC220 | DWV220 | DGV220 |
| 100 | DGC100 | DWV100 | DGV100 |
Abrasives available
Aluminum oxide (treated/untreated)
Silicon carbide (treated/untreated)
With more than 40 years of abrasive technology expertise, Darmann Semiconductor delivers resin- and vitrified-bond dressing boards that reduce load pressure, removes loose diamonds, and improves blade-edge concentricity for consistently clean cuts.
Case studies
Extended blade life in an IC wafer application
Darmann’s hubbed dicing blades outperformed the customer’s required 1,600 m product lifespan, achieving 2,050 m without sacrificing product quality.
Replacing the competitors’ blade in a GaAs LED application
Darmann’s hubbed dicing blades successfully replaced a major competitor’s offering by meeting the same 2,500 m performance for a GaAs LED application.
Longer blade life with consistent MOS wafer quality
Darmann’s hubbed dicing blades achieved 5% greater average life than the leading competitor’s, 2,000 m versus 1,900 m, while delivering stable wafer quality.
Custom engineering. On-site optimization.
Darmann Semiconductor engineers work on-site with your team to understand your dicing blades and production, determining the right blade dimensions and dressing board specifications to optimize your manufacturing.
The results? Cleaner, more consistent cuts. Longer-lasting blade sharpness. Reduced dressing time. We achieve it all with a reliable supply, at a lower total cost of ownership.