The precision to meet your specs. The supply to match global growth.
INTRODUCING DARMANN SEMICONDUCTOR
Don’t compromise on quality, consistency, or vendor exposure. Darmann Semiconductor builds dicing blades and dressing boards to spec while maintaining and exceeding the quality of your existing supplier… all at a lower total cost of ownership.
Darmann helps semiconductor manufacturers get real results:
1 μm thinner wafer kerf
vs market leader with Darmann dressing boards
Front-end dicing + back-end singulation
complete suite of abrasive products
Semiconductor applications
Darmann Semiconductor works directly with clients to understand production specs and needs, while helping them achieve business goals in a ruthlessly competitive field.
Wafer dicing
Package singulation
Semiconductor packaging
Get ahead of the competition
Achieve micron-level dicing precision and superior lifespan for both dicing blades and dressing boards with custom-engineered Darmann Semiconductor products.
Customized to your production line
Lower your costs without sacrificing quality. Darmann’s engineers work with you to determine the blade and/or dressing board specifications necessary to meet and exceed your manufacturing goals.
Our semiconductor clients see lower total costs, greater product life, and the supply to reliably scale business.