Semiconductor
Precision Solutions for Semiconductor Applications
Global electrification and expanded green energy solutions are growing at unprecedented speed which is driving growth in the production of more efficient semiconductor devices. To maintain top-tier quality and performance in the production of these devices, precision and accuracy are paramount throughout every stage of the process.
Darmann excels in delivering advanced products used in the production of semiconductor devices (analog and mixed signal devices, ASICs, FPGA’s, power IC’s, MOSFETs, BJTs, IGBTs, FPGAs, ASICs, LEDs and more).
Our dicing blades and dicing blade dresser boards deliver consistent, precision performance with substrate materials including silicon (Si), silicon carbide (SiC), gallium nitride (GaN), gallium arsenide (GaAs), glass, ceramic, and sapphire (Al2O3). Darmann’s proprietary bonding systems and high-quality manufacturing practices help lower manufacturing costs, reduce chipping, and improve overall quality.